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Heat sink compounds

Viscous fluid which increases the thermal conductivity of a thermal interface by filling microscopic air-gaps present due to the imperfectly flat and smooth surfaces of the components. In electronics, it is often used to aid a component's thermal dissipation via a heat sink.
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Xilence XZ018 heat sink compound 5.15 W/m·K 1 g
€5.69 €4.78 -
Cooler Master EU Product - W+?rmeleitpaste CRYOFUZE 7
€16.92 €14.22 -
ASUS ROG RG-05 THERMAL PASTE
€14.18 €11.92









