Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/mÂ·K 3 g

SKU

XZ019

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€9.19 €7.72

Available to order (4 in stock)

Delivery: 7-10 days

Thermal Paste X5 High Performance, 2.5 g

Category: Heat sink compounds

More Information

More Information
Manufacturer	Xilence
SKU	XZ019
EAN	4044953501074
Availability	In Stock

Reviews

Description

Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300Â°C â€“ therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g.

Specifications

Features
Thermal resistance	0.201 Â°C/W
Viscosity note	73 CPS
Thermal conductivity	5.15 W/mÂ·K
Operating temperature (T-T)	-30 - 280 Â°C
Product colour	Black, Red, White
Certification	CE
Technical details
Compliance certificates	RoHS
Thermal resistance	0.201 Â°C/W
Viscosity note	73 CPS
Thermal conductivity	5.15 W/mÂ·K
Operating temperature (T-T)	-30 - 280 Â°C
Certification	CE
Weight & dimensions
Weight	3 g
Package width	120 mm
Package depth	20 mm
Package height	10 mm

Packaging data
Package width	120 mm
Package depth	20 mm
Package height	10 mm
Quantity per pack	1 pc(s)
Operational conditions
Operating temperature (T-T)	-30 - 280 Â°C
Colour
Product colour	Black, Red, White
Logistics data
Quantity per pack	1 pc(s)

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Type	N/A	Thermal paste	N/A	Thermal paste	Thermal paste	Thermal paste